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 Compliant with the following condition:
(1) Leaded quantity of product below 100ppm
(2) Lead-free process
a. Soldering Conditions
Shape |
Symbol |
Hand Soldering |
DIP Soldering |
Reflow Soldering |
Lead Frame & Holder Type |
|
1. Temp. at tip of iron: 400°C Max. (30W Max.)
2. Soldering time: 3 sec Max.
3. Distance: 3mm Min.
(From slder joint to case) |
1. Preheat temp. 100°C Max. 60 sec Max.
2. Bath temp: 265 Max.
3. Bath time: 5 sec Max.
4. Distance: 3mm Min
(From solder joint to case)
|
No
|
SMD Type |
|
1. Temp. at tip of iron: 350 °C Max. (30W Max.)
2. Soldering time: 3 sec Max. |
1. Preheat temp. 120~100°C 60~120sec
2. Bath temp: 260 Max.
3. Bath time: 5 sec Max. |
|
b. Lead-free soldering process by Shape
Shape |
Product Name |
Lead Frame & Holder Type |
Photo Link, Lamp LED, LED Assembly, Digit Display, Lead Frame Display, Dot Matrix Display, High Power LED, Light Bar Display, Phototransistor, Pin Photodiode, ITR, IRM, Photo Coupler |
SMD Type |
SMD LED, SMD DISPLAY, Phototransistor for SMD Type, Pin Photodiode for SMD Type, IrDA, Photo Coupler |
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Criteria |
Cadmium restrictions |
Cadmium and its compounds must not be present in parts, components, materials or products. Cadmium and its compounds must not be used as stabilizers, coloring agent or as a surface coating treatment in parts, components, materials or products. |
< 5 ppm |
Lead restrictions |
Lead and/or lead compounds shall not be present in hardware components or parts, however, except solder, electrical componenets and interconnet materials.
Lead carbonates and sulfates must not be used in any paint applied to parts, component or products.
|
< 100 ppm |
Mercury restrictions |
Mercury must not be contained in any part, material, component or product, including bu not limited to switches, relays or electrical contacts.
This restriction does not apply to lamps with less than 10 mg of mercury.
. |
< 5 ppm |
| Hexavalent chromium (chromium VI) and hexavalent chromium compounds |
Hexavalent chromium (chromium VI) and hexavalent chromium compounds must not be present in parts, components, materials or products. |
< 100 ppm |
| Polybrominated Biphenyls (PBBs) |
Plastic parts, components, materials and products must not contain Polybrominated Biphenyls as flame retardants. Specific PBBs but are not limited to, those listed in attachment item.. |
0 ppm |
| Polybrominated Biphenyls (PBDEs) |
Plastic parts, components, materials and products must not contain Polybrominated Diphenyls Ethers, known as flame retardants. Specific PBBEs, but are not limited to, those listed in attachment item.. |
0 ppm |
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